Potassium hydroxide is commonly used, especially in the chemical industry. We must not be particularly familiar with the characteristics of this material. The following small edition mainly explains the relationship between this material and micro arc oxidation of magnesium alloy. Let's take a look at it:
When the micro arc oxidation decreases, the voltage required for the micro arc light on the metal surface is directly related to the conductivity of the electrolyte. The higher the conductivity of the electrolyte, the faster the transfer and the migration of charged particles in the plasma. "Metal dielectric gas electrolyte" four-stage system is formed in the process of microarc oxidation, which is more effective. The film surface is easy to be decomposed and the discharge arc light appears. Therefore, reduce the required external voltage to reach the breakdown voltage.
Adding different concentration of potassium hydroxide into Na2SiO3 solution, the change curve of the thickness of micro arc oxidation film was obtained. The film thickness increased with the increase of concentration, but when the product concentration increased to a certain extent (≥ 1.5g / L), the increase of film thickness slowed down or even stopped. This may be due to the fact that the increase of product concentration, the increase of growth rate of the film, the corresponding increase of the generated film and dissolution rate, which leads to the increase of the thickness of the film.
In addition, in addition to KOH in Na2SiO3 solution (i.e. When KOH concentration is zero), the reaction and film formation can also be carried out normally. It is shown that the specific oxide film and the non contributing potassium hydroxide only change the composition and properties of the solution, affect the process of the reaction and thus affect the film rate.
Through the above contents, we can understand the relationship between potassium hydroxide and micro arc oxidation of magnesium alloy. We hope that the knowledge described in this paper can help you, and pay more attention to this problem in the future operation and use of this material.