Used for cyanide-free plating, dyeing, refined clay, etc.
1 主要用于无氰电镀，替代氰化钠作为电镀的络合剂。也用作电镀的前处置剂和焦磷酸电镀液。配制衣料用洗濯剂组分、金属外表清洗剂和瓶子洗净剂组分、各种清洁剂的添加剂。用作陶瓷工业的黏土分散剂，颜料和染料的分散剂弛缓冲剂。漂染工业用于除去水中的少量三价铁离子，进步漂染质量。 焦磷酸钾亦是双氧水的稳定剂。
1. It is mainly used in cyanide-free electroplating instead of sodium cyanide as complexing agent for electroplating. It is also used as pre-disposal agent and pyrophosphate electroplating solution. Composition of laundry detergent, metal surface detergent and bottle detergent, additives of various detergents. Used as clay dispersant, dispersant relaxant buffer for pigments and dyes in ceramic industry. The bleaching and dyeing industry is used to remove a small amount of trivalent iron ions from water and improve the quality of bleaching and dyeing. Potassium pyrophosphate is also an excellent stabilizer for hydrogen peroxide.
2. It is used in food industry as emulsifier, tissue improver, chelating agent, and as raw material of alkali water for flour products. It is commonly used in conjunction with other condensated phosphates to avoid the formation of bird droppings in canned aquatic products and discoloration of canned fruits; to improve the shrinkage of ice cream, the yield of ham and sausage, the water holding capacity of ground fish; to improve the taste and yield of noodles, and to avoid cheese aging.
3. Potassium pyrophosphate can also be used as a complexing agent for alkaline electroless nickel plating and as a detergent. Pyrophosphates can also be used as complexing agents for alkaline nickel plating.
Copper coating is widely used in multi-layer plating of iron and steel parts, as well as "bottom" layer of tin, gold and silver plating, in order to improve the separation force between base metal and coating. When the copper coating is porous, the corrosion resistance of the outer coating can be greatly improved. At present, the common method of copper plating in industry is to use cyanide-containing salt plating solution. The defects of cyanide plating solution are toxic and bring harm to the environment in the process of application. The development trend of electroplating industry is to adopt the method of low toxicity or non toxicity copper plating.
The process of pyrophosphate copper plating is simple in composition, stable in bath, high in current efficiency, good in uniform and deep plating, fine in crystallization, fast in plating speed and no irritant gas escaping from the plating process. It is a low toxicity and excellent copper plating method. The main components of pyrophosphate plating bath are copper pyrophosphate supplying copper ions and potassium pyrophosphate as complexing agent, which can react to form complex copper potassium pyrophosphate. In addition to complexing with copper, potassium pyrophosphate also partially dissociates from the plating bath, which can stabilize the complexing salt and improve both plating and deep plating abilities. Therefore, with the implementation of the national ban on cyanide plating, pyrophosphate copper plating, as the representative of cyanide-free plating, will be adopted by more plating plants.
There is a defect in the comparison between pyrophosphate copper plating and cyanide copper plating, that is, orthophosphate exists in pyrophosphate plating bath, and the content of orthophosphate in the plating bath will increase with time, which will seriously affect the quality of plating.