Used for cyanide-free plating, dyeing, refined clay, etc.

　　1 主要用于无氰电镀，替代氰化钠作为电镀的络合剂。也用作电镀的前处置剂和焦磷酸电镀液。配制衣料用洗濯剂组分、金属外表清洗剂和瓶子洗净剂组分、各种清洁剂的添加剂。用作陶瓷工业的黏土分散剂，颜料和染料的分散剂弛缓冲剂。漂染工业用于除去水中的少量三价铁离子，进步漂染质量。 焦磷酸钾亦是双氧水的稳定剂。

　　1. It is mainly used in cyanide-free electroplating instead of sodium cyanide as complexing agent for electroplating. It is also used as pre-disposal agent and pyrophosphate electroplating solution. Composition of laundry detergent, metal surface detergent and bottle detergent, additives of various detergents. Used as clay dispersant, dispersant relaxant buffer for pigments and dyes in ceramic industry. The bleaching and dyeing industry is used to remove a small amount of trivalent iron ions from water and improve the quality of bleaching and dyeing. Potassium pyrophosphate is also an excellent stabilizer for hydrogen peroxide.

　　2 在食品工业中用作乳化剂，组织改良剂，螯合剂，还用作面制品用碱水的原料。多与其他缩合磷酸盐合用，通常用于避免水产罐头产生鸟粪石，避免水果罐头变色；进步冰淇淋收缩度，火腿、香肠的得率，磨碎鱼肉的持水性；改善面类口味及进步得率，避免干酪老化等。

　　2. It is used in food industry as emulsifier, tissue improver, chelating agent, and as raw material of alkali water for flour products. It is commonly used in conjunction with other condensated phosphates to avoid the formation of bird droppings in canned aquatic products and discoloration of canned fruits; to improve the shrinkage of ice cream, the yield of ham and sausage, the water holding capacity of ground fish; to improve the taste and yield of noodles, and to avoid cheese aging.

　　3. 焦磷酸钾也可用作碱性化学镀镍的络合剂以及用于配制洗濯剂。焦磷酸盐也可用作碱性电镀镍的络合剂。

　　3. Potassium pyrophosphate can also be used as a complexing agent for alkaline electroless nickel plating and as a detergent. Pyrophosphates can also be used as complexing agents for alkaline nickel plating.

　　铜镀层普遍用于钢铁件多层镀覆以及镀锡、镀金和镀银等的“底”层，以进步基体金属与镀层的分离力。当铜镀层无孔时，可大大进步外表镀层的抗蚀性。目前，工业上普遍的电镀铜办法是运用含氰化物盐类的镀液，氰化镀液的缺陷是具有毒性，在运用过程中对环境带来危害。采用低毒或镀铜的办法是电镀行业的开展趋向。

　　Copper coating is widely used in multi-layer plating of iron and steel parts, as well as "bottom" layer of tin, gold and silver plating, in order to improve the separation force between base metal and coating. When the copper coating is porous, the corrosion resistance of the outer coating can be greatly improved. At present, the common method of copper plating in industry is to use cyanide-containing salt plating solution. The defects of cyanide plating solution are toxic and bring harm to the environment in the process of application. The development trend of electroplating industry is to adopt the method of low toxicity or non toxicity copper plating.

　　焦磷酸盐镀铜工艺成分简单、镀液稳定、电流效率高、均镀才能和深镀才能较好、镀层结晶细致，镀速快，电镀过程没有刺激性气体逸出，是一种低毒、性能优良的镀铜办法。焦磷酸盐镀液的主要成分是供应铜离子的焦磷酸铜和作为络合剂的焦磷酸钾，此两者能作用生成络盐焦磷酸铜钾。焦磷酸钾除了与铜生成络盐外，还有一局部游离于镀液中，它能够使络盐稳定并可进步镀液均镀才能和深镀才能。因而，随着国度对氰化电镀禁限令的执行，作为无氰电镀的代表--焦磷酸盐镀铜将被更多的电镀厂采用。

　　The process of pyrophosphate copper plating is simple in composition, stable in bath, high in current efficiency, good in uniform and deep plating, fine in crystallization, fast in plating speed and no irritant gas escaping from the plating process. It is a low toxicity and excellent copper plating method. The main components of pyrophosphate plating bath are copper pyrophosphate supplying copper ions and potassium pyrophosphate as complexing agent, which can react to form complex copper potassium pyrophosphate. In addition to complexing with copper, potassium pyrophosphate also partially dissociates from the plating bath, which can stabilize the complexing salt and improve both plating and deep plating abilities. Therefore, with the implementation of the national ban on cyanide plating, pyrophosphate copper plating, as the representative of cyanide-free plating, will be adopted by more plating plants.

　　焦磷酸盐镀铜与氰化镀铜比拟有一个缺陷，就是焦磷酸盐电镀液中存在着正磷酸盐，随着时间的延长电镀液中正磷酸盐的含量会增加，将严重影响电镀质量。

　　There is a defect in the comparison between pyrophosphate copper plating and cyanide copper plating, that is, orthophosphate exists in pyrophosphate plating bath, and the content of orthophosphate in the plating bath will increase with time, which will seriously affect the quality of plating.